On this page · 13 sections
- How to read the dates in this article
- Status check: all 12 approved projects
- What changed in 2026
- Tata's Assam OSAT: the plant that decides 2027 packaging output
- HCL-Foxconn at Jewar: display driver chips, from 2028
- Tata-PSMC Dholera: the fab, the node and the 2028 date
- The five running units: what India already ships
- The next wave: compound semiconductors and advanced packaging
- The 2027 calendar: what to watch
- Worked example: how much packaging capacity is actually running?
- What this means for buyers in 2027
- How eCorpIT can help
- References
Summary. India has approved 12 semiconductor manufacturing projects in six states under the first phase of the Semicon India Programme, with cumulative investment of more than Rs 1.64 lakh crore, and five were in commercial production as of October 2026, the government said on 6 November 2026. The five are Micron, Kaynes Semicon, CG Semi, CDIL and Suchi Semicon, and PIB counts all five as assembly, test and packaging units; none is a wafer fab. Of the three plants people ask about most, only one should start in 2027. Tata's Assam OSAT at Jagiroad is in trial production, and the IT minister wants production to begin by 31 March 2027. HCL-Foxconn's Jewar unit broke ground on 21 February 2026, and HCL's chairperson said manufacturing starts in 2028. The Cabinet says the Tata-PSMC fab at Dholera is due to be commissioned in 2028, starting mostly at 90nm according to Bloomberg; first silicon in early 2027 is only a press report. Our verdict for CTOs: chips made in India in 2027 will be packaged and tested here from imported wafers. Plan no 2027 product on Indian-made wafers.
About this article. For CTOs, procurement heads and hardware teams planning around Indian chip capacity in 2027. We checked every plant, investment, capacity and date against India Semiconductor Mission (ISM) pages, PIB and Cabinet releases and company pages and on-record statements, and labelled anything only reported in the press. Status is as of 7 November 2026. Some ISM PDFs were read through archived copies; one Business Standard page could not be opened, so its claims are cited through other outlets. General information, not investment or procurement advice; no company paid for inclusion. Researched with AI assistance and reviewed by our editorial team.
How to read the dates in this article
Chip project dates slip, and sources speak with different authority. Every date below carries one of these labels.
- Running: ISM or PIB confirms commercial production.
- Official target: a date in a PIB release, an ISM document or an on-record statement by a Union minister.
- Company: a date the company publishes or one of its leaders states on record.
- Press target: reported by the media, a state official or unnamed people, and not confirmed by the company or the central government.
- No date: nothing published.
Status check: all 12 approved projects
Investments and capacities are from the Cabinet and PIB releases for each approval and PIB's 2025 project tables. The set is one silicon fab, one silicon carbide fab, one gallium nitride micro-LED display fab and nine packaging units.
| Project | Location | Approved | Investment | Design capacity | Status, November 2026 | Label |
|---|---|---|---|---|---|---|
| Micron ATMP (memory) | Sanand, Gujarat | Jun 2023 | Rs 22,516 crore | DRAM and NAND assembly and test, phased ramp-up | Commercial production since Feb 2026 | Running |
| Kaynes Semicon OSAT | Sanand, Gujarat | Sep 2024 | Rs 3,307 crore | 6.33 million chips a day | Production since 31 Mar 2026 | Running |
| CG Semi OSAT (CG Power, Renesas, Stars) | Sanand, Gujarat | Feb 2024 | Rs 7,600 crore | 15 million chips a day | Inaugurated 4 Jul 2026; second plant under construction | Running |
| CDIL (discrete devices) | Mohali, Punjab | Aug 2025 | Rs 117 crore | 158 million units a year | Commercial line opened 17 Sep 2026 | Running |
| Suchi Semicon OSAT | Surat, Gujarat | May 2026 | Not separately published | 1,033 million chips a year | Commercial line opened 17 Sep 2026 | Running |
| Tata TSAT OSAT | Jagiroad, Assam | Feb 2024 | Rs 27,000 crore | 48 million chips a day | Trial production | Official target FY2026-27 |
| HCL-Foxconn (India Chip) | Jewar, Uttar Pradesh | May 2025 | Rs 3,700 crore | 20,000 wafers and 36 million units a month | Ground broken 21 Feb 2026 | Company: 2028 |
| Tata-PSMC silicon fab | Dholera, Gujarat | Feb 2024 | Rs 91,000 crore | 50,000 wafer starts a month | Under construction | Official target 2028 |
| SiCSem (silicon carbide) | Bhubaneswar, Odisha | Aug 2025 | Rs 2,066 crore | 60,000 wafers and 96 million packaged units a year | Fiscal support agreement May 2026 | Press target 2027-28 |
| 3D Glass Solutions | Bhubaneswar, Odisha | Aug 2025 | Rs 1,943 crore | About 70,000 glass panels and 50 million units a year | Ground broken 19 Apr 2026 | Official target Aug 2028 |
| ASIP | Andhra Pradesh | Aug 2025 | Rs 468 crore | 96 million units a year | Fiscal support agreement Oct 2026 | No date |
| Crystal Matrix | Dholera, Gujarat | May 2026 | Not separately published | GaN mini and micro-LED display fab plus ATMP | Approved | No date |
ISM's post of 3 November 2026 names the five producing projects, and PIB records that CDIL and Suchi opened their commercial lines on 17 September 2026. Crystal Matrix and Suchi Semicon were approved together on 5 May 2026 for about Rs 3,936 crore; Suchi's capacity is 1,033.2 million chips a year. The 15 May 2026 release on Rajasthan's first semiconductor plant is not a 13th project: it covers Sahasra Semiconductors at Bhiwadi, an SME packaging unit built under MeitY's SPECS scheme, not ISM.
What changed in 2026
- 21 February to 31 March: ground broken at Jewar; Micron (28 February) and Kaynes (31 March) started production in Sanand.
- 19 April: foundation stone for 3D Glass Solutions in Bhubaneswar.
- 5 May: Cabinet approved Crystal Matrix and Suchi Semicon, the 11th and 12th projects.
- 4 July: CG Semi's OSAT inaugurated in Sanand.
- 15 July: Cabinet approved Semicon 2.0 at Rs 1,27,500 crore.
- 31 August and 16 September: Semicon 2.0 gazette notification, then guidelines for pillars 2, 3 and 4.
- 17 September: CDIL and Suchi opened commercial lines, taking the count to five.
- 6 November: Semicon 2.0 application portal opened for pillars 2, 3 and 4.
Tata's Assam OSAT: the plant that decides 2027 packaging output
Tata Semiconductor Assembly and Test (TSAT) was approved on 29 February 2024 for Morigaon district, Assam, at Rs 27,000 crore, with 48 million chips a day, flip chip and integrated system in package technologies, and target segments including automotive, EVs, consumer electronics, telecom and mobile phones.
The government's date has moved twice. A PIB backgrounder of 17 November 2024 projected completion by mid-2025, and PIB's SEMICON India note of 1 September 2025 expected Phase 1 to be commissioned by April 2026. Both have passed. The current signals are firmer:
- Ministerial target. After meeting Assam's chief minister on 30 May 2026, IT Minister Ashwini Vaishnaw said production should begin within the current financial year, that is by 31 March 2027, India Today NE reported.
- Company. Tata's CEO told SEMICON India 2026 that Jagiroad construction is on track. Tata's page still calls it an upcoming greenfield facility, with more than USD 3 billion invested on a 171-acre campus near Guwahati; its Vemgal OSAT in Karnataka has operated since December 2023.
- Trial runs. Assam's Chief Secretary told the Assam Tribune on 21 September that trial runs were at about a quarter of planned capacity, that commercial production was likely by December or January, and that operations could take one to two years more to stabilise. The Federal reported on 21 October that pilot production had begun.
Label: official target FY2026-27. Tata has not published a commercial start date. Treat December 2026 to March 2027 as the window and the first year as a ramp.
HCL-Foxconn at Jewar: display driver chips, from 2028
The Cabinet approved the HCL and Foxconn joint venture on 14 May 2025 as the sixth ISM unit, near Jewar airport in the Yamuna Expressway Industrial Development Authority area, to make display driver chips for phones, laptops, cars and PCs, designed for 20,000 wafers and 36 million units a month, for Rs 3,700 crore. A 2025 PIB backgrounder prints 36 million units a year; we follow the Cabinet release.
PIB describes the project company, India Chip Pvt Ltd, as an OSAT facility under the ATMP scheme, so it will assemble and test chips from wafers made elsewhere. The Prime Minister joined its foundation-stone ceremony by video on 21 February 2026. There, HCL chairperson Roshni Nadar said manufacturing would start in 2028 and reach full capacity of 36 million chips a month by 2028, Business Today reported.
Label: company, 2028. Any 2027 production date you see is a press target.
Tata-PSMC Dholera: the fab, the node and the 2028 date
Dholera is the only silicon wafer fab among the 12 projects. The Cabinet approved it on 29 February 2024 at Rs 91,000 crore, with Taiwan's Powerchip Semiconductor Manufacturing Corp (PSMC) as technology partner and 50,000 wafer starts a month, listing 28nm high-performance compute chips and power management chips for EVs, telecom, defence, automotive and consumer electronics. At full design capacity that is 50,000 × 12 = 600,000 wafer starts a year. Tata describes a 300mm fab for analog and logic chips from 28nm to 110nm.
The plan changed in July 2026.
- Timing. The Cabinet's Semicon 2.0 release of 15 July says the first fab is scheduled to be commissioned in 2028. Tech Times reported that the minister put commercial production at mid-2028 the same day, against an earlier aim of end-2026.
- Node. Bloomberg reported on 17 July that Tata will start mostly at 90nm, a mature node used in industrial and automotive chips. Tata said the plan was always to start with 55nm and 90nm, then 28nm; PSMC said 28nm is the partnership's most advanced process and that mature-node starts are common.
- First silicon. Tech Times reported that industry sources expected first silicon in the first half of 2027. No Tata or government source confirms that.
- Readiness. In September 2026 Tata announced work with Kelington on operational readiness and materials deals with Sojitz and NRS and with Sumitomo Chemical, plus MoUs with JSR for photoresists and Ascendas for a 363-acre supplier park.
Labels: press target for first silicon in 2027; official target of 2028 for commissioning. First wafers start a qualification process; they are not parts you can order.
The five running units: what India already ships
Micron, Sanand. Assembly and test of DRAM and NAND, in commercial production since February 2026; Micron's CEO told SEMICON India 2026 that production is live. Treat it as memory assembled and tested in India, not Indian-made memory wafers; our note on the server DRAM and SSD shortage in 2027 covers supply.
Kaynes Semicon, Sanand. Approved in September 2024 at Rs 3,300 crore and 60 lakh chips a day (PIB's 2025 figures: Rs 3,307 crore, 6.33 million a day). PIB said at the 31 March 2026 opening that it supplies intelligent power modules to a California-based customer, with much of its output booked for export.
CG Semi, Sanand. CG Power's unit with Renesas and Stars Microelectronics, for consumer, industrial, automotive and power chips. PIB said in 2025 that the first facility, G1, handles about 0.5 million units a day and the second, G2, will scale to 14.5 million. CG expected G2 to be complete by 2026, Business Today reported in August 2025; we found no later update. At the July 2026 opening, PIB put commercial output at 20 crore units a year, with a target of 500 crore.
CDIL, Mohali. A brownfield expansion by Continental Device India for high-power MOSFETs, IGBTs and diodes in silicon and silicon carbide.
Suchi Semicon, Surat. An OSAT for discrete semiconductors used in power electronics, analog and industrial systems. With eInfochips, it delivered what PIB called India's first commercial QFN chips in September 2026.
The next wave: compound semiconductors and advanced packaging
- SiCSem, Bhubaneswar. India's first commercial compound semiconductor fab, built with the UK's Clas-SiC, for defence, EV, rail, charger, data centre and solar uses. PTI reported at its November 2025 ground-breaking that it should be operational by 2027-28.
- 3D Glass Solutions, Bhubaneswar. Glass substrates and advanced packaging at Rs 1,943.53 crore, including Rs 799 crore of central support; commercial production is expected by August 2028 and full volume by August 2030.
- ASIP, Andhra Pradesh. System-in-package assembly with APACT of South Korea; fiscal support agreement signed in October 2026.
- Crystal Matrix, Dholera. An integrated GaN fab and ATMP for mini and micro-LED display modules.
Semicon 2.0 sets up the next round. The Cabinet approved it on 15 July 2026 with Rs 1,27,500 crore across six pillars: chip design, machines and materials, more fabs, ATMP and OSAT, research and development, and talent. PTI reported that the government expects about Rs 4 lakh crore of investment and Rs 2 lakh crore of production over the scheme period; by September the minister cited about Rs 1 lakh crore of commitments. Applications for pillars 2, 3 and 4 opened on 6 November 2026, with a target of at least three major equipment makers and five chemicals and gases companies. The same day, 12 more ECMS component approvals took that scheme to 118 projects and Rs 77,051 crore. Our Semicon 2.0 funding explainer covers the incentive rates.
The 2027 calendar: what to watch
| When | Project or event | What to watch | Label |
|---|---|---|---|
| December 2026 to March 2027 | Tata Assam OSAT | Commercial start, the sixth running unit | Official target FY2026-27 |
| Any time in 2027 | Semicon 2.0 pillars 2 to 4 | First approvals for equipment, materials, fabs and OSATs | No date |
| First half of 2027 | Tata-PSMC Dholera | First silicon or trial wafers | Press target |
| 2027 | CG Semi G2 | Ramp towards 14.5 million units a day | Company target was 2026; no update |
| 2027 to 2028 | SiCSem | Start of operations | Press target |
| 2028 | Tata-PSMC Dholera | Commissioning; mid-2028 reported for commercial output | Official target |
| 2028 | HCL-Foxconn Jewar | Start of manufacturing | Company |
| August 2028 | 3D Glass Solutions | Commercial production | Official target |
Recheck each line after every ISM announcement; ISM's home page timeline is the quickest signal.
Worked example: how much packaging capacity is actually running?
Design capacities come in different units, so this is an order-of-magnitude check, not an output forecast. We converted each figure in the status table to millions of units a day (365 days a year; 365 ÷ 12 days a month).
| Project | Published design capacity | Million units a day (our conversion) | Running? |
|---|---|---|---|
| Tata Assam | 48 million chips a day | 48.00 | No, trial runs |
| CG Semi (G1 plus G2) | 15 million chips a day | 15.00 | G1 only, about 0.55 |
| Kaynes Semicon | 6.33 million chips a day | 6.33 | Yes |
| Suchi Semicon | 1,033.2 million chips a year | 2.83 | Yes |
| HCL-Foxconn Jewar | 36 million units a month | 1.18 | No |
| CDIL | 158.38 million units a year | 0.43 | Yes |
| ASIP | 96 million units a year | 0.26 | No |
| SiCSem packaging | 96 million units a year | 0.26 | No |
| 3D Glass Solutions packaging | 50 million units a year | 0.14 | No |
| Total | 74.44 |
Micron and Crystal Matrix publish no comparable figure and are left out. CG Semi's running figure is PIB's 20 crore units a year ÷ 365 = 0.55 million a day.
- Assam is almost two-thirds of the pipeline. 48 ÷ 74.44 = 64.5%. At full design capacity it would mean 48 × 365 = 17.52 billion chips a year.
- Little of the design total runs today. Kaynes, CG Semi, Suchi and CDIL at full design capacity would be 6.33 + 15 + 2.83 + 0.43 = 24.59 million a day, or 33.0%. With CG Semi at its current 0.55 million, running capacity is nearer 10.14 million a day, or 13.6%.
- 2027 turns on two plants. If Tata Assam and CG Semi G2 ramp in 2027, capacity changes in scale; if they slip, 2027 looks like late 2026.
What this means for buyers in 2027
| If you need | Domestic option | 2027 status | What to do |
|---|---|---|---|
| DRAM or NAND products | Micron Sanand (assembly and test) | Running | Ask suppliers which part numbers are assembled and tested in Sanand |
| Power modules, discretes, microcontroller or analog packages | Kaynes, CG Semi, Suchi Semicon | Running; CG G2 not yet | Qualify as a second source and check package types |
| High-power discrete devices | CDIL Mohali | Running | Evaluate for industrial and automotive bills of materials |
| High-volume packaging at scale | Tata Assam | Official target FY2026-27 | Start qualification talks; treat 2027 volume as a ramp |
| Display driver ICs | HCL-Foxconn Jewar | Company target 2028 | Keep current suppliers through 2027 |
| Mature-node wafers (90nm, 55nm) | Tata-PSMC Dholera | Official target 2028 | Do not schedule a 2027 product on Dholera wafers |
| Silicon carbide power devices | SiCSem | Press target 2027-28 | Watch only |
A short checklist for procurement and engineering leads:
- Ask what Indian-made means. Separate wafer origin, assembly site and test site on quotes and certificates of conformance.
- Budget for qualification. New plants need customer qualification before volume, and automotive and industrial parts take longest.
- Dual-source during ramps. Do not single-source a 2027 product on a plant still ramping.
- Use domestic sourcing where it pays. Phone makers should read our explainer on the Mobile Phone Manufacturing Scheme.
- Review quarterly. Move dates only on official or company confirmation.
Compute is a separate supply question; our guide to IndiaAI GPU capacity through C-DAC covers GPUs, which none of these plants make.
How eCorpIT can help
eCorpIT is a Gurugram-based technology organisation, founded in 2021, assessed at CMMI Level 5 and MSME certified, with senior-led engineering teams working across AWS, Microsoft and Google platforms. Our ESDM manufacturing execution and traceability service builds the part, lot and supplier traceability that shows which site assembled a chip and when a second source was qualified. Talk to us at /contact-us/.
Last updated: 7 November 2026.
